Recently, SHW Technology (Shanghai) Co., Ltd. (hereinafter referred to as "SHM Technology "), a provider of semiconductor wafer permanent bonding solutions, completed a new round of financing. This round was led by Oriza PuHua (Suzhou) Investment, with participation from numerous renowned investment institutions and industry partners, including Hefei Industry Investment, Waniu Capital, Suzhou Clivia Capital, Sassan Capital, Xichen Capital, SND High-Tech, Orient Renaissance Capital, and Domo Semi-Tech. The funds will be primarily used for the domestic market expansion of core equipment—including hybrid bonding equipment, XO1 composite substrate fully automatic bonding equipment, BSPDN fully automatic bonding equipment, high-vacuum heterogeneous bonding equipment, and D2W hybrid bonding wafer surface treatment systems—to accelerate product industrialization and customer delivery.
Headquartered in the Pudong New Area of Shanghai, with an R&D center in Japan, SHM Technology focuses on semiconductor wafer permanent bonding solutions. The company has formed a unique R&D advantage through deep synergy between its Chinese and Japanese teams. Its globally pioneered IFB bonding technology enables high-efficiency, non-destructive in-situ bonding of two wafers, marking a breakthrough in the field of low-stress heterogeneous bonding. Currently, the company's products have been sampled and highly recognized by several leading Fab plants both domestically and internationally. Strategic cooperation and procurement agreements have been reached with multiple mass-production clients and research institutes across Chinese Mainland, Taiwan, and Japan.
As the legal advisor and long-term partner of SHM Technology, Llinks leveraged its extensive project experience in the investment and financing sector to provide professional legal services for this round of financing.
Llinks Engagement Team
Selena She, Partner
Colin Shi, Partner
Joyce Zhang, Partner
