In April 2023, Suzhou Keyang Semiconductor Co., Ltd., a leading company in advanced packaging, completed one round financing of over RMB 500 million.
Keyang is a high-tech enterprise specializing in wafer-level packaging and testing services. Its annual chip output could reach 3 billion units per year. Relying on the research and development of advanced packaging and testing technology, it offers a variety of packaging solutions such as TSV, WLCSP, Bumping, SiP, etc. The main service products include image sensors, 5G filters and SIP modules, biometric chips, MEMS chips, etc., which are widely used in consumer electronics, Automotive electronics, security monitoring, 5G communications and IoT and other fields.
After the completion of this financing, Keyang will further integrate upstream and downstream resources in the industrial chain, promote the layout of high-quality characteristic packaging and testing industries that complement each other with advantages such as 12-inch TSV vehicle regulations packaging special lines and high-end vehicle regulations CIS packaging , RF chip and packaging testing module.
Llinks Team:
Partners: Selena She, Colin Shi
