In July 2023, Zhongshan Xincheng Semiconductor Co., Ltd. (hereinafter referred to as "Xincheng Semiconductor") completed several hundred million yuan of financing in angel round, Pre-A round and A+ round, mainly for product research and development, factory construction and equipment procurement. Among them, Pre-A round was led by Dinghui Baifu.
Xincheng Semiconductor was established in 2022 and is an integrated circuit packaging substrate solution provider. The company's high-density flip-chip packaging substrate mass production phase one factory officially started operation on June 19. The company adopts MSAP (modified semi-additive method), ETS (embedded trace technology), SAP (semi-additive method) three processing routes, and has the R&D capability of 10/10μm line width/line spacing FC CSP, FC BGA substrate. At this stage, the factory can realize L/S 15/15 line WB CSP, FC CSP, SiP substrate production, and successively complete the first SiP order delivery and FC CSP order sample delivery. According to the plan, Xincheng Semiconductor will achieve the ability to deliver FC BGA substrate samples to customers while advancing FC CSP mass production this year, and continue to increase the proportion of FC CSP and FC BGA capacity in the future.
Xincheng Semiconductor has a domestic leading packaging substrate R&D team, with core members having an average of more than 12 years of packaging substrate technology R&D and mass production experience.
Llinks acted as the legal counsel for Dinghui Baifu, providing professional legal services for Dinghui Baifu's investment in this project with its rich project experience in the field of investment and financing.
Llinks Team:
Partners: Selena She, Colin Shi
