Shanghai UniVista Industrial Software Group (hereinafter referred to as "UniVista"), a leading provider of high-performance EDA and industrial software solutions in China, recently announced that it has completed a Pre-A round of financing of over 1.1 billion yuan. So far, UniVista has completed two rounds of financing with a total investment amount of nearly RMB3 billion.
This round of financing was jointly invested by Shangqi Capital (a subsidiary of SAIC Group), IDG Capital, CAS Investment, China Automotive Chip Alliance, Feixiang Capital, Guangqi Capital and a number of other well-known institutions, while several existing shareholders including Summitview High-tech Venture Capital and Mulan Investment participated in this Pre-A round of financing as well.
The launch round of financing of UniVista was completed in 2021 and was jointly launched by national industry funds (including the National IC Industry Investment Phase II and China Internet Investment Fund), professional investment institutions of the technology and semiconductor industry (including Summitview High-tech Venture Capital, Sequoia China, Weihao Chuangxin and Shenzhen Capital Group) and a number of well-known IC industry leaders and their affiliated funds (including Wingtech Technology, Will Semiconductor, Mulan Investment, Maxscend Microelectronics, Shanghai Hanmai, Huaqin Technology and other world-renowned IC design companies). The launch round of financing of UniVista amounted to over RMB1.7 billion yuan, which is the largest single round of financing in domestic EDA field to this date.
Acting as the legal counsel of UniVista, Llinks provided professional legal services to UniVista for this Pre-A round and previous rounds of financing with its rich project experience in the field of investment and financing.
Llinks Team:
Partners: Selena She, Colin Shi
Counsel: Joyce Zhang
